Samsung Electronics has introduced a series of semiconductor solutions aimed at driving digital transformation over the next decade, such as integrating intelligence into semiconductors and Strengthening industry cooperation.
During Samsung Tech Day 2022, System LSI business emphasized its goal of becoming a “one-stop solution Fables“, And to be the one-stop solution provider that integrates different logic technologies into one platform to deliver optimized solutions to customers.
Currently offering around 900 productsincluding SoC (System on Chip), image sensor, modem, display controller IC (DDI), power management IC (PMIC), and security solutions.
“In an age that requires machines to learn and think as people do, Logic chips, which perform the functions of the brain, heart, nervous system and eyes, are growing to unprecedented levels.Young In Park, President and Head of System LSI Business Division at Samsung said.
Samsung refers to it His goal is to “reach a level that enables them to perform human tasks.” In addition to people”, so they will be the basis of hyper-intelligence, hyper-connectivity and hyper-data, which are the key areas of the Fourth Industrial Revolution.
With this vision in mind, System LSI Business focuses on improving the performance of its core IPs such as NPU (Neural Processing Unit) and modem, as well as innovating CPU (Central Processing Unit) and GPU (Processing Unit) technology. graphics processing) by cooperating with leading companies in the global industry.
A day ago, the company’s contract chip production unit, Samsung foundryit was mentioned 1.4 nanometer (nm) chips will be commercialized by 2027.
During the conference, Samsung also shared developments in the field of logic chips, including the 5G Exynos Modem 5300 (mobile), Exynos Auto V920 (cars), and QD OLED DDI (home appliances).
As for memory works, Samsung introduced the fifth generation of 10nm dynamic memory class (1b), as well as the eighth and ninth generation of vertical NAND memory (V-NAND).. In this area, the South Korean manufacturer also highlighted the importance of collaborative partnerships in meeting new challenges in the industry.
“One trillion gigabytes is the total amount of memory Samsung has made since its inception over 40 years ago. Almost half of that trillion has been produced in the past three years alone, indicating how rapid digital transformation is progressing,” said Jong Bae Lee, President and Head of Memory Business In Samsung Electronics.
Samsung DRAM 1b is currently in development with plans for mass production in 2023. To overcome challenges in scaling DRAM beyond the 10 nanometer range, the company is developing disruptive solutions in patterns, materials, and architecture, using technology such as the High-K material.
Samsung also highlighted its upcoming DRAM solutionsSuch as 32GB DDR5 DRAM, 8.5Gbps LPDDR5X DRAM and 36Gbps GDDR7 DRAM, which will bring new capabilities to the datacenter, HPC, mobile, gaming and automotive sectors.
In terms of V-NAND memory, it is clear that in its 8th generation 512GB it offers an improvement in bit density by 42 percent., achieving the highest bit density in the industry among 512GB three-cell (TLC) memory products to date. The highest capacity 1TB TLC V-NAND will be available to customers later this year.
The company also indicated that the ninth generation of V-NAND is in development and scheduled for mass production in 2024. By 2030, Samsung plans to stack more than 1,000 layers to enable future data-intensive technologies.
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